The NTU Team Won Again in the DAC/ISSCC Design Contest
Bringing Taiwan Ultra High Resolution Image Processing Industries
Enormous Business Opportunities
The 46th DAC (Design Automation Conference) announced the winning teams of its DAC/ISSCC Student Design Contest on July 27th. The NTU team, led by Institute of Electronics Professor Liang-Gee Chen, and comprised of six students came to the fore with "4096'2160 Multiview Video Encoder Chip for 3D/Quad HDTV Applications" in this rigorous contest and won the top prize, their stellar performance was to be commended. That NTU team was able to win the contest for the fourth time in this top notch contest and set a record for ISSCC was nothing short of a shock for the participants, and Professor Chen's team was able to win this award again is also quite amazing.
The DAC/ISSCC Student Design Contest is by far the most prestigious conference contest in international computer aided design and chip design. The DAC and the ISSCC (International Solid-State Circuit Conference) jointly holds this contest every year. For a team to come forward, it has to come up with a chip product that can make great contributions to the chip industry or achieve a great breakthrough. For this year's contest, over 60 top universities from the world participated, and the winning teams included Stanford University, UC Berkeley, University of Illinois at Urbana/Champaign, proving that NTU enjoyed leading technology and innovative thinking in the area of chip design and has marched into the ranks of the top universities in the world. What is also worth mentioning is that another team from Taiwan also made the winner's list. Professor His-Pin Ma, the guiding professor of the Tsing-Hua University team, is also a native doctorate from NTU.
The chip design submitted by the NTU winning team can provide image processing technology simultaneously for high resolution 3D TV and ultra high resolution 4K x 2K TV. Its image processing capability is 3.4 times the video encoders found on the market. As the first integrated circuit in the world, it is also low power consuming, low cost, and low in memory bandwidth. It is expected that this chip will become the core technology for the next generation ultra high resolution TV and three dimensional images, pushing the world toward more advanced 3D television and a larger screen of ultra high resolution. By virtue of this product, Taiwan's image processing industries can enter into the era of ultra high resolution, and the design capability of 3D imaging products can be greatly enhanced, thus bringing enormous business opportunities for the Taiwan industry.